Complete 31-machine production line for double-side and multilayer PCBs. Cut, drill, image, etch, plate, HASL/OSP, profile, test, and pack. Images and key parameters for every machine, linked to it...
From raw laminate to vacuum-packed finished board — every machine in the catalog, in the order it sits on the line. Click any card to open the dedicated product page with full parameters and specifications.
Cut raw laminate, grind edges, drill tooling/through-holes
Cuts raw PCB laminate sheet to working panel size.
| Cut board size | Width 120–1400 mm / Length 200–1600 mm |
|---|---|
| Cutting speed | 0–15 m/min |
| Substrate thick | 0.12–3.0 mm |
| Power | 3-phase / 380 V / 4 kW |
+ 2 more specs on detail page
Automatic grinding of PCB edges after cutting, 4-stage grinding + auto load/unload.
| Footprint | L3950 × W3200 × H1100 mm |
|---|---|
| Plate thickness | 0.4–3.0 mm |
| Board size | Max 730 × 730 mm / Min 230 × 230 mm |
| Transmission | 12 m/min, ~16 PNL/min |
+ 2 more specs on detail page
Drills through-holes and tooling holes for multilayer and double-side boards.
| X/Y velocity | 100 m/min |
|---|---|
| Z velocity | 50 m/min |
| Spindle max | 200 krpm |
| Drill range | Ø0.1–6.5 mm |
+ 2 more specs on detail page
6-spindle simultaneous drilling and routing for high-throughput panel prep.
| Spindle | 6 spindles, 60 000 rpm |
|---|---|
| Actual stroke | 650 × 700 mm |
| Position accuracy | 0.02 mm / 300 mm |
| Repeat accuracy | 0.01 mm / 300 mm |
+ 2 more specs on detail page
Pre/mid/post copper-surface treatment — brushing, rinsing, air-knife drying.
| Working width | 650 mm |
|---|---|
| Plate thickness | 0.15–3.2 mm |
| Brush | #500 × 4 sets, 1280 rpm, 1.5 kW |
| Rinse | Double side, 1.1 kW pump |
+ 2 more specs on detail page
Coat photoresist, expose pattern, develop resist
Stretches and pre-tensions silk screens for solder-mask and legend printing.
| Max drawing area | 1200 × 1500 mm |
|---|---|
| Max tension | >30 N/cm |
| Footprint | 1500 × 1200 × 850 mm |
| Packing | L1900 × W600 × H400 mm |
+ 2 more specs on detail page
Pre-bake, post-bake and solder-mask cure oven — 0 to 260 °C PID control.
| Power | 12 kW / 380 V |
|---|---|
| Temperature | RT – 260 °C |
| Drying size | 1200 × 900 × 1600 mm |
| Insulation | High-density fibre cotton |
+ 2 more specs on detail page
Vacuum-frame UV exposure for photo-engraving, silk-screen plates and stencils.
| Working size | 1200 × 1500 mm |
|---|---|
| Table size | 1300 × 1600 mm |
| Outsize | 1400 × 1800 × 1200 mm |
| Power | 3 kW / 220 V |
+ 2 more specs on detail page
Flatbed screen printer for solder mask, legend, and graphic overlays.
| Max print size | 600 × 1200 mm |
|---|---|
| Max frame size | 800 × 1700 mm |
| Throughput | 1200 pcs/h |
| Print thickness | ≤30 mm |
+ 2 more specs on detail page
Conveyor UV tunnel for drying UV ink and solder-mask prints.
| Power | 380 V / 50 Hz / 15 kW |
|---|---|
| Working width | 650 mm |
| UV lamps | 5.6 kW × 2, individually controlled |
| Transfer speed | 0.5–30 m/min |
+ 2 more specs on detail page
Hot-roll lamination of dry-film photoresist onto inner and outer layers.
| Plate size | 250–610 × 250–650 mm, 0.05–3.2 mm thick |
|---|---|
| Dry film width | 250–610 mm |
| Lamination temp. | 50–150 °C ± 2 °C |
| Lamination speed | 0.5–6 m/min |
+ 2 more specs on detail page
UV-LED parallel-light exposure for circuit, solder-mask and legend, both sides at once.
| Exposure size | 1200 × 900 mm |
|---|---|
| Exposure time | ≤35 s |
| Resolution | ≥50 µm |
| Uniformity | ≥95% |
+ 2 more specs on detail page
Photoplotter — Gerber film output at 4000–12000 dpi for imaging.
| Structure | External drum scanning |
|---|---|
| Resolution | 4000 / 8000 / 12000 dpi |
| Plot area | 600 × 800 mm |
| Min line / space | 2 mil / 2 mil |
+ 2 more specs on detail page
Film processor / developer — develops, fixes, washes, and dries photoplotter film.
| Footprint | 1.75 × 1.08 × 1.04 m (L×W×H) |
|---|---|
| Power | 220 V ± 10% / 30 A / 50 Hz / 1-phase |
| Tank volume | Developing, fixing, washing — 20 L each |
| Speed | 10 mm/s (30 s develop) → ~24" film in 1 min |
+ 2 more specs on detail page
Etch copper, plate through-holes, plate copper
Develops photoresist pattern and rinses/dries panel before etching.
| Working width | 650 mm |
|---|---|
| Developing length | 2000 mm, 4 kW × 4 pumps |
| Working temp | RT – 65 °C |
| Cascade rinse | 1000 mm, 2.2 kW pump |
+ 2 more specs on detail page
Double-side conveyor spray etcher for copper removal with swing system for uniform etch.
| Working width | 650 mm |
|---|---|
| Etching length | 4000 mm, 5.5 kW × 8 pumps |
| Spray | Double-side with oscillation |
| Heater | Titanium pipe, 3 kW |
+ 2 more specs on detail page
Strips remaining photoresist after etching, rinses and dries panel.
| Working width | 650 mm |
|---|---|
| Stripping length | 4000 mm, 4 kW × 4 pumps |
| Working temp | RT – 65 °C |
| Cascade rinse | 1000 mm |
+ 2 more specs on detail page
Through-hole metallization by autocatalytic copper deposition.
| Tank size | W300 × H700 × L600 mm |
|---|---|
| Tank material | 12 mm PP + 15 mm PP |
| Heater | Titanium, 3 kW each |
| Rectifier | 6 V / 100 A |
+ 2 more specs on detail page
Black-hole / direct-metallization through-hole plating as a PTH alternative.
| Footprint | 45 680 × 2100 × 1840 ± 25 mm |
|---|---|
| Conveyor speed | 0.5–10 m/min (adjustable) |
| Board size | Max 680 × 680 mm / Min 150 × 150 mm |
| Plate thickness | 0.4–3.2 mm |
+ 2 more specs on detail page
Panel and pattern electroplating — copper / tin / tin-antioxidant.
| Tank size | W300 × H700 × L600 mm |
|---|---|
| Tank material | 12 mm PP + 15 mm PP |
| Heater | Titanium, 3 kW each |
| Rectifier | 6 V / 100 A |
+ 2 more specs on detail page
HASL, OSP, ENIG and other surface finishes
Cleans PCB surface and coats flux before hot-air solder levelling.
| Working width | 600 mm |
|---|---|
| Plate thickness | 0.5–3.2 mm |
| Max / min board | 600 × 600 mm / 100 × 100 mm |
| Brush | Ø80 × 615 mm |
+ 2 more specs on detail page
Hot-air solder levelling — uniform tin coating on copper pads.
| Max board size | 610 × 540 × 6 mm |
|---|---|
| Capacity | 250–300 pcs/h |
| Tin tank | 200 kg |
| Air-knife pressure | 5 kg/cm² (adjustable) |
+ 2 more specs on detail page
Cleans residual soldering flux and other organics after tin spraying.
| Working width | 600 mm |
|---|---|
| Plate thickness | 0.2–3.2 mm |
| Brush | Ø103 × 615 mm @ 1500 rpm |
| Hot water temp | RT – 55 °C |
+ 2 more specs on detail page
Organic solderability preservative coating on copper pads.
| Working width | 650 mm |
|---|---|
| Transmission | 0.5–3 m/min (VFD) |
| Working height | 950 ± 25 mm |
| Max / min PCB | W600 mm × L / 150 × 80 mm |
+ 2 more specs on detail page
V-cut, CNC V-cut, final scoring
Manual V-cut scoring for aluminium and FR4 PCB panel separation.
| Plate width | 35–480 mm |
|---|---|
| Cutting thickness | 0.6–3.2 mm |
| Cutter motor | 4 kW |
| Total power | 8 kW / 380 V |
+ 2 more specs on detail page
Automatic CNC V-groove cutting for high-precision, high-volume panel separation.
| Process | Automatic V-groove scoring |
|---|---|
| Application | Aluminium PCB, FR4, CEM |
| Mode | Servo-driven CNC |
| Repeat accuracy | ±0.05 mm |
+ 2 more specs on detail page
Guide hole drilling, flying probe test
Automatic guide / target-hole drilling for multilayer lamination registration.
| Spindle speed | 20 000 – 60 000 rpm |
|---|---|
| Hole diameter | 0.3 – 4.2 mm |
| Working area | 600 × 1200 mm |
| Process thickness | 0.25 – 2.0 mm |
+ 2 more specs on detail page
CCD-aligned automatic guide-hole drilling for high-yield registration.
| Positioning | CCD automatic alignment |
|---|---|
| Accuracy | ±0.025 mm |
| Material width | 100–550 mm |
| Drill diameter | Ø1–5 mm (interchangeable nozzles) |
+ 2 more specs on detail page
Final wash, vacuum lamination, vacuum pack
Final soft-brush wash + DI water rinse + air-knife drying for finished boards.
| Working width | 650 mm |
|---|---|
| Plate thickness | 0.15–3.2 mm |
| Brush | #1000 × 2 sets, 1280 rpm, 1.5 kW |
| Rinse | Overflow + DI water, 1.1 kW pump |
+ 2 more specs on detail page
Vacuum-pack finished PCBs for shipping — clean, sealed packs.
| Working size | W550 × L800 mm |
|---|---|
| Film width | 610–620 mm |
| Vacuum pump | 1.1 kW × 2 |
| Heating | 28 kW electrothermal |
+ 2 more specs on detail page
Multi-layer PCB lamination under vacuum — 4-layer hot/cold press with carrier plates.
| Configuration | 4 layers / 1 H+C + 1 cold press |
|---|---|
| Press area | 22" × 26" × 4 OPEN |
| Heating | Electrical thermo-oil heating unit |
| Cooling | Cooling control system |
+ 2 more specs on detail page
Tell us your panel size, target throughput, and which surface finish you need. Our engineers will send back a configured BOM, layout sketch, and quote within 48 hours.
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