PCB Etching Equipment and Wet processing equipment and Chemical Milling machine and Metal etchers


Electroless copper plating and electroplating equipment

  • Small size PTH MACHINE for Laboratory use
  • Model:GE-CT300
  • Maximum machining size: 250× 300mm
  • Minimum via aperture:0.2mm
  • Plating tank volume :25L
  • Out size:1200*950*1200mm
  • double sided through-hole copper sinking for non-metallic materials such as double-sided and multi-sided circuit boards
  • small size Electro copper plating machine
  • Model:GE-DT300
  • Maximum machining size: 250× 300mm
  • Plating tank volume :25L
  • Power:AC220V /50Hz
  • Out size:1200*950*1200mm
  • This small copper plating machine is used for thickening after the completion of the electroless copper plating
  • Manual Electroless Copper Plating machine for Small scale production
  • Tank 1: Cleaning: 32 liters, To to 55°C  →  Tank 2: Washing water: 32 liters  →  Tank 3: Axit Cleaning: 16 liters  →  Tank 4: Washing water: 32 liters   →  Tank 5: Micro Etching: 16 liters   → Tank 6: Washing water: 32 liters  →  Tank 7: Pre-Plating: 16 liters  →  Tank 8: Activation: 16 liters →  Tank 9: Washing water: 32 liters  →  Tank 10: Acceleration: 16liters →  Tank 11: Washing water: 32 liters  →  Tank 12: Electroless Copper: 16 liters  →  Tank 13: Washing water: 32 liters → Tank 14: Sunfur Axit : 16 liters →  Tank 15: Copper plating: 45 liters →  Tank 16: Copper plating: 45 liters Tank → 17: Atinox: 16 liters → Tank 18: Over flow washing: 32 liters
  • Semi-automatic Plated through hole(PTH) machine
  • Process flow: Deburring → alkaline degreasing → secondary or tertiary countercurrent rinsing → roughening (micro erosion) → secondary countercurrent rinsing → pre leaching → activation → secondary countercurrent rinsing → degumming → secondary countercurrent rinsing → PTH → secondary countercurrent rinsing → pickling
  • It will do the plated through hole process after drilling for two layers or multilayer board. The process and size of this PTH equipment can be customized according to customer requirements.
  • Manually Nickel and Copper Plating Production Line
  • Model: GE-NC650
  • size of machine : L13580*W1800*H1980mm
  • production capacity :1500-2000㎡
  • size of maximal board:850mm*650mm
  • Volume of plating tank:L1150*W350*H900mm
  • The Manually nickel and copper plating production line is for PCB & FPC industry.
  • Electroless nickel immersion gold (ENIG) plating machine for PCB
  • Model: GE-NG650
  • Ultrasonic degreasing → hot water washing → water washing → degreasing → hot water washing → water washing 1 → water washing 2 → micro-etching → water washing → activation → water washing 1 → water washing 2 → water washing 3 → pure water washing → nickel plating 1 → nickel plating 2 → recycling → Water washing 1 → Water washing 2 → Water washing 3 → Gold plating → Recycling → Water washing 1 → Water washing 2 → Water washing 3 → Gold plating → Recycling → Water washing 1 → Water washing 2 → Water washing 3 → Protection → Water washing 1 → Water washing 2 → Hot water washing
  • Fume hoods electro plating station Laboratory use
  • Model: GE-FHEP650
  • working process:loading--electro plating--water rinsing--unloading
  •  All fume hoods are designed, manufactured and installed in accordance with international standards, both in size, shape, function and technology to meet different chemical, biological, and pharmaceutical laboratory requirements..