PCB Etching Equipment and Wet processing equipment and Chemical Milling machine and Metal etchers


small copper plating machine


small copper plating machine

Features:This small copper plating machineis used for thickening after the completion of the electroless copper plating

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Main technical parameter:
Model :DT350
maximum processing size :250*300mm
minimum hole diameter :0.2 mm
Plating tank volume: 15 L
Control mode: intelligent instruments
Machine material : PP plate
Dimensions: 380 × 450 × 380mm
Plating current :0-10A
Power supply: AC220V 50Hz